Chips with multiple semiconductor-sized IO must be adapted to board level for high performance compute needs such as Artificial Intelligence (AI). This requires fine line space conductive tracks and microvias in a range of advanced materials. We have solutions for the most challenging materials such as Bismaleimide-Triazine (BT) or standard high-performance Ajinomoto Build-up Film (ABF). Our systems are focused on the following capabilities:

• Via drilling with high aspect ratios from 80 µm diameter all the way down to 15 µm in ABF, BT or RCC substrates
• Cavities of any size for bridges, die, antennae, thermal bars or other embedded devices which involve precision machining through the substrate core with minimal heat affected zone (HAZ) in BT & ABF
• Stop-layer cavities for embedded devices in BT or ABF which only contact a single side of the substrate, require specialist machining profiles like skiving, or multi-pass perimeter profiles which are more precise than mechanical routers
• Direct write for selective patterning of structures directly onto substrates, like copper traces down to 5 µm width and 5/5 line spacing, by either direct ablation (SMI technology), activation of a resist or removal of mask for subsequent plating processes
• Custom laser machining profiles of any shape for depaneling or unique packaging conditions

Msolv have experience with many other advanced packaging & electronics applications, please contact us to find out more.