The Scalable PV Solution: Why MSV200 Is Built for What’s Next
This is the final part in our deep dive series into the scalable solutions offered by msolv® for the photovoltaics industry. This part focuses on
YOUR IC SUBSTRATE LASER PARTNER
Direct Write for Organic Substrates
Our machines stand at the forefront of high-volume manufacturing being compatible with chip-first or chip-last fanout wafer level packaging processes. Specifically designed for laser direct write, they target integrated circuit (IC) substrates like BT, ABF & RCC with unparalleled precision.
The better alternative to direct imaging is direct write
msolv direct write key features:
- Short pulse width lasers to eliminate heat affected zone
- Small vias made possible, particularly in challenging BT substrates
- High throughput, not just vias but cavities too
- High speed via size switching – enables multiple via sizes in a single layer
- High speed switching from via and cavity applications which require different beam profiles (Gaussian & top-hat)
- High positional accuracy up to ± 5µm
In addition we have solutions available for flexibles (FPC), probe cards and board depaneling using similar technology.
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MSV100 Precision and Flexibility for Pioneering Solar Cell R&D
This is part 4 of our blog series on scale up photovoltaic manufacturing from cell development to full-scale production. In Part 3 we discussed the