The Scalable PV Solution: Why MSV200 Is Built for What’s Next
This is the final part in our deep dive series into the scalable solutions offered by msolv® for the photovoltaics industry. This part focuses on
NOVEL SCANNED MASK IMAGING (SMI) TECHNOLOGY
Embedded Conductor Patterning
Scanned Mask Imaging (SMI) is novel technology that takes advantage of the low running costs associated with solid state laser systems, as well as the flexibility and quality of process offered by imaging systems. Our proprietary technology allows direct ablative removal of materials down to a resolution of a few microns.
Intricate patterns are etched seamlessly onto substrates, ready for package integration
The structures created by SMI enable embedded circuitry—a critical requirement for next-generation fanout IC substrates and interposers. Some of the benefits of embedded conductor technology are described below:
- Increased power density due to more efficient use of the available space
- Enables thinner IC packages due to removal of the conductive core from the substrate
- Better electrical performance due to lower parasitic inductance in the tracks
- Lower substrate warpage due to extremely high surface planarity between the substrate layers
- Tighter bump and interconnect pitch since embedded conductors more easily allow periphery-staggered bond pads and vias
- Higher reliability of circuitry due to “three-point anchoring” of copper traces
SMI is a unique technology from msolv which has applications beyond embedded conductors, click to learn more.
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MSV100 Precision and Flexibility for Pioneering Solar Cell R&D
This is part 4 of our blog series on scale up photovoltaic manufacturing from cell development to full-scale production. In Part 3 we discussed the