INDUSTRIES &
APPLICATIONS
PRINTING & LASER INNOVATION
Industries & Applications
At msolv® we develop new advanced manufacturing processes and equipment for the advanced electronics and photovoltaic (PV) sectors. Our expertise lies in laser systems tailored for advanced electronics and photovoltaics, revolutionizing the way we harness energy and create electronic devices.
Our solutions are used at some of the top IC substrate manufacturers in the world, with the global switch to sustainable energy driving the adoption of our laser machines in the Perovskite area of the PV industry too.
We engage with any commercial, scientific or novel project for certain industries. Contact us if you’d like to discuss how we might help with your application.
REVOLUTIONIZING IC SUBSTRATES WITH DPSS LASERS
Advanced Packaging
At msolv®, our mission is to redefine the boundaries of technology. Solid state lasers have been a game-changer for integrated circuit (IC) substrates. We pioneered the use of psG DPSS lasers for IC substrates and printed circuit boards (PCBs). Why? Because they enable very fine feature ablation.
Our experience spans years of research, development, and practical implementation. We make tools for drilling high-aspect-ratio vias to connect different layers within the substrate. Smal vias are essential to bridge layers, enabling efficient signal flow in challenging materials. Bismaleimide-Triazine (BT), Ajinomoto build-up film (ABF), resin coated copper (RCC)—our lasers are compatible. Think chip-to-chip bridges, antennae, and thermal bars. Our lasers skive cavities with minimal heat-affected zones (HAZ) in BT & ABF.
msolv® expertise extends beyond ICs. Contact us for solutions in advanced packaging, flexible electronics, and more.
YOUR IC SUBSTRATE PARTNER
Direct Write for Organic Substrates
At msolv®, we’re not just in the game; we’re rewriting the rules. Our machines lead the charge in high-volume manufacturing, seamlessly integrating with both chip-first and chip-last fanout wafer or panel-level packaging (FOWLP POPLP) processes.
We selectively pattern structures directly onto substrates. Our machines tackle IC substrates like Bismaleimide-Triazine (BT), Ajinomoto Build-up Film (ABF), and Resin-Coated Copper (RCC). These composite materials pose challenges due to unique fillers and unpredictable warpage gained throughout the process, but our lasers cut through them with unparalleled precision. Whether it’s adapting semiconductor-sized IO chips to board level or enabling high-performance compute for Artificial Intelligence (AI), our lasers play a pivotal role.
Our solutions extend beyond substrates. Think flexible electronics, probe cards, and unique substrates. If it’s a challenge, we’re up for it.
NOVEL SCANNED MASK IMAGING (SMI) TECHNOLOGY FROM MSOLV
Embedded Conductor Patterning
At msolv®, we thrive on innovation, and our latest gem, Scanned Mask Imaging (SMI) technology, ushers in a new era of precision micromachining. SMI capitalizes on the low running costs associated with solid-state laser systems and capex figures that don’t make-your-eyes-water like excimer sources. We can make copper traces with narrow lines and spaces of 5 / 5 µm. Enable higher efficiency, precision, and innovation in your electronics.
Our proprietary technology allows direct removal of materials down to a resolution of a few microns. Think of it as etching with laser precision. Intricate patterns emerge seamlessly on substrates, paving the way for embedded circuitry. Why is this critical? Because it’s the backbone of next-gen fanout IC substrates and interposers.
Efficient space utilization means higher power efficiency, and as a benefit of embedding the conductors you can remove the conductive core from the substrate, and slim down the entire IC package.
PRECISION ABLATION TOOLS FOR THE GROWING RENEWABLE ENERGY MARKET
Laser Scribing P1, P2 & P3
As our planet seeks sustainable solutions, solar energy plays a vital role. Organic thin-film solar cells represent a promising avenue for tapping into the sun’s boundless energy. These flexible, lightweight cells can be integrated seamlessly into various surfaces, from rooftops to portable devices.
Ultrashort pulse lasers play a pivotal role in shaping modern organic thin-film solar cells. Their unique characteristics of pulses in the picosecond or femtosecond range enable precise material removal without collateral damage. The laser ablation process leaves no residue, leaving the solar panel pristine – no debris, no contamination.
Laser is the only way to maximize conductor volumetric density for efficient energy conversion. Lasers remove material precisely, creating ultra-sharp edges, ready for plating or inkjet to enhance cell performance. msolv laser scribing solutions enable an economically viable process.
EMPOWERING A SUSTAINABLE FUTURE: MSOLV PLAYS A PIVOTAL ROLE IN SOLAR ENERGY
Inkjet Printing for Perovskite
Solar power is indispensable for a greener, cleaner future and photovoltaic (PV) cells are improving in efficiency day-by-day. One of the most promising chemistries for the latest tandem cells are perovskites. At msolv, we stand at the forefront of this transformative journey, harnessing cutting-edge technologies like industrial inkjet which synergizes seamlessly with perovskites. Inkjet enhances traditional manufacturing processes, enabling precise material deposition and intricate patterning.
We understand the critical interplay of materials. Whether it’s the choice of substrates, encapsulants, or conductive layers, msolv ensures compatibility for optimal performance. Our experts can help you with ink formulations, viscosity, and drying kinetics to achieve uniform deposition. We know how precise layer-to-layer alignment is paramount: our solutions address these challenges to ensure robust and efficient solar cell production.
REVOLUTIONIZING SOLAR PANEL MANUFACTURING COSTS
One Step Interconnect
At msolv, we’re not content with the status quo. We innovate. Our one step interconnect (OSI) is poised to streamline the solar industry. It simplifies cell manufacturing, by integrating inkjet printing and laser structuring into a single step machine.
OSI will shorten the production line, accelerating the journey from raw materials to finished panels. We know that fewer machines is lower capital expenditure and better resource utilization, making panel production cost-effective. Moreover every panel handling step introduces risk of contamination and damage. OSI minimizes panel transfers, safeguarding quality and increasing yield. Our combined system marries inkjet printing and laser structuring. Inkjet deposits the functional layers, while the laser precisely structures them. The result? Faster build times without compromising quality.
NEED A SYSTEM FOR A UNIQUE PROCESS OR CUSTOM CONTROL FUNCTIONS?
Laser & Inkjet Systems
REVOLUTIONIZING IC SUBSTRATES WITH DPSS LASERS
Advanced Packaging
At msolv®, our mission is to redefine the boundaries of technology. Solid state lasers have been a game-changer for integrated circuit (IC) substrates. We pioneered the use of psG DPSS lasers for IC substrates and printed circuit boards (PCBs). Why? Because they enable very fine feature ablation.
Our experience spans years of research, development, and practical implementation. We make tools for drilling high-aspect-ratio vias to connect different layers within the substrate. Smal vias are essential to bridge layers, enabling efficient signal flow in challenging materials. Bismaleimide-Triazine (BT), Ajinomoto build-up film (ABF), resin coated copper (RCC)—our lasers are compatible. Think chip-to-chip bridges, antennae, and thermal bars. Our lasers skive cavities with minimal heat-affected zones (HAZ) in BT & ABF.
msolv® expertise extends beyond ICs. Contact us for solutions in advanced packaging, flexible electronics, and more.
YOUR IC SUBSTRATE PARTNER
Direct Write for Organic Substrates
At msolv®, we’re not just in the game; we’re rewriting the rules. Our machines lead the charge in high-volume manufacturing, seamlessly integrating with both chip-first and chip-last fanout wafer or panel-level packaging (FOWLP POPLP) processes.
We selectively pattern structures directly onto substrates. Our machines tackle IC substrates like Bismaleimide-Triazine (BT), Ajinomoto Build-up Film (ABF), and Resin-Coated Copper (RCC). These composite materials pose challenges due to unique fillers and unpredictable warpage gained throughout the process, but our lasers cut through them with unparalleled precision. Whether it’s adapting semiconductor-sized IO chips to board level or enabling high-performance compute for Artificial Intelligence (AI), our lasers play a pivotal role.
Our solutions extend beyond substrates. Think flexible electronics, probe cards, and unique substrates. If it’s a challenge, we’re up for it.
NOVEL SCANNED MASK IMAGING (SMI) TECHNOLOGY FROM MSOLV
Embedded Conductor Patterning
At msolv®, we thrive on innovation, and our latest gem, Scanned Mask Imaging (SMI) technology, ushers in a new era of precision micromachining. SMI capitalizes on the low running costs associated with solid-state laser systems and capex figures that don’t make-your-eyes-water like excimer sources. We can make copper traces with narrow lines and spaces of 5 / 5 µm. Enable higher efficiency, precision, and innovation in your electronics.
Our proprietary technology allows direct removal of materials down to a resolution of a few microns. Think of it as etching with laser precision. Intricate patterns emerge seamlessly on substrates, paving the way for embedded circuitry. Why is this critical? Because it’s the backbone of next-gen fanout IC substrates and interposers.
Efficient space utilization means higher power efficiency, and as a benefit of embedding the conductors you can remove the conductive core from the substrate, and slim down the entire IC package.
PRECISION ABLATION TOOLS FOR THE GROWING RENEWABLE ENERGY MARKET
Laser Scribing P1, P2 & P3
As our planet seeks sustainable solutions, solar energy plays a vital role. Organic thin-film solar cells represent a promising avenue for tapping into the sun’s boundless energy. These flexible, lightweight cells can be integrated seamlessly into various surfaces, from rooftops to portable devices.
Ultrashort pulse lasers play a pivotal role in shaping modern organic thin-film solar cells. Their unique characteristics of pulses in the picosecond or femtosecond range enable precise material removal without collateral damage. The laser ablation process leaves no residue, leaving the solar panel pristine – no debris, no contamination.
Laser is the only way to maximize conductor volumetric density for efficient energy conversion. Lasers remove material precisely, creating ultra-sharp edges, ready for plating or inkjet to enhance cell performance. msolv laser scribing solutions enable an economically viable process.
EMPOWERING A SUSTAINABLE FUTURE: MSOLV PLAYS A PIVOTAL ROLE IN SOLAR ENERGY
Inkjet Printing for Perovskite
Solar power is indispensable for a greener, cleaner future and photovoltaic (PV) cells are improving in efficiency day-by-day. One of the most promising chemistries for the latest tandem cells are perovskites. At msolv, we stand at the forefront of this transformative journey, harnessing cutting-edge technologies like industrial inkjet which synergizes seamlessly with perovskites. Inkjet enhances traditional manufacturing processes, enabling precise material deposition and intricate patterning.
We understand the critical interplay of materials. Whether it’s the choice of substrates, encapsulants, or conductive layers, msolv ensures compatibility for optimal performance. Our experts can help you with ink formulations, viscosity, and drying kinetics to achieve uniform deposition. We know how precise layer-to-layer alignment is paramount: our solutions address these challenges to ensure robust and efficient solar cell production.
REVOLUTIONIZING SOLAR PANEL MANUFACTURING COSTS
One Step Interconnect
At msolv, we’re not content with the status quo. We innovate. Our one step interconnect (OSI) is poised to streamline the solar industry. It simplifies cell manufacturing, by integrating inkjet printing and laser structuring into a single step machine.
OSI will shorten the production line, accelerating the journey from raw materials to finished panels. We know that fewer machines is lower capital expenditure and better resource utilization, making panel production cost-effective. Moreover every panel handling step introduces risk of contamination and damage. OSI minimizes panel transfers, safeguarding quality and increasing yield. Our combined system marries inkjet printing and laser structuring. Inkjet deposits the functional layers, while the laser precisely structures them. The result? Faster build times without compromising quality.
NEED A SYSTEM FOR A UNIQUE PROCESS OR CUSTOM CONTROL FUNCTIONS?
Laser & Inkjet Systems
Blog
Our Latest News

The Scalable PV Solution: Why MSV200 Is Built for What’s Next
This is the final part in our deep dive series into the scalable solutions offered by msolv® for the photovoltaics industry. This part focuses on

MSV100 Precision and Flexibility for Pioneering Solar Cell R&D
This is part 4 of our blog series on scale up photovoltaic manufacturing from cell development to full-scale production. In Part 3 we discussed the
Blog
Our Latest News

The Scalable PV Solution: Why MSV200 Is Built for What’s Next
This is the final part in our deep dive series into the scalable solutions offered by msolv® for the photovoltaics industry. This part focuses on

MSV100 Precision and Flexibility for Pioneering Solar Cell R&D
This is part 4 of our blog series on scale up photovoltaic manufacturing from cell development to full-scale production. In Part 3 we discussed the
Do you need technical support?
We understand that technical issues can arise at any moment, which is why our Technical Support team is dedicated to providing you with swift assistance. Our experts are available around the clock to ensure that your technical problems are resolved with minimal downtime.