MSV100 Precision and Flexibility for Pioneering Solar Cell R&D

PHOTOVOLTAIC SCALE UP, PRODUCT SPOTLIGHT

MSV100 Precision and Flexibility for Pioneering Solar Cell R&D

This is part 4 of our blog series on scale up photovoltaic manufacturing from cell development to full-scale production. In Part 3 we discussed the benefits of MSV700 for sensitive material development like perovskites and thin films, we dive deeper into the developmental process to explore an alternative system for R&D, the MSV100. MSV100 brings full-process control, laser precision, and lab-scale flexibility to wafer-level solar cell development. It’s especially powerful for teams working on emerging PV structures that demand tight tolerances and adaptable tooling.

Small Parts, Big Impact – Scalable Innovation Starts Here.

As solar cell research moves toward next-generation materials like perovskites and tandem structures, the need for compact, precise, and adaptable processing tools becomes critical. The MSV100 from msolv® is designed specifically to meet these demands, offering an ideal platform for cell development and small-format device fabrication. Its support for substrate sizes ranging from 100 x 100 mm up to 300 x 300 mm means standard PV wafer sizes M0 to M12 can be diced, scribed or isolated into minimodules. This makes it a versatile choice for both early-stage research and technology qualification.

Typical challenges in cell development and research:

Limited flexibility in early-stage R&D tools
Precision issues in ultrathin or sensitive layers
Time-consuming tool reconfiguration
High cost of overheads for small-format processing
Complex user interfaces and slow learning curves
Scalability gaps between R&D and production

The MSV100 resolves a number of these issues by being compact in size but highly capable, providing tight process control for scribing and patterning across a wide range of photovoltaic device architectures. Its precision motion stages and customizable process head enable high-accuracy scribing, while integrated options such as vision alignment systems ensure repeatability. Powered by msolv®’s pioneering SBS process, scribe alignment can be controlled to within single digit microns. This is particularly valuable for researchers developing ultrathin perovskite layers or exploring new stack designs where thermal and mechanical tolerances are especially sensitive.

Users can select from multiple laser sources, such as nanosecond, picosecond or femtosecond, and define tool paths and scribe widths through an intuitive software interface. With ultra-short pulse lasers (e.g., femtosecond or picosecond), the MSV100 minimizes heat-affected zones (HAZ) and microcracking, reducing the risk of device failure during or after processing. For labs working on multiple structures or device configurations, this flexibility eliminates the inefficiencies of switching between tools or reconfiguring fixed systems.

Equipped with configurable laser optics capable of scribing the standard PV interconnection patterns of P1 (front contact isolation), P2 (interlayer removal for connection), and P3 (back contact isolation).This allows researchers to prototype full interconnect stacks directly on test wafers or small substrates — critical for validating materials or device concepts before scaling up.

Designed with modularity at its core, the MSV100 can be tailored to a wide variety of experimental needs. Whether you develop flat or semi-rigid substrates, like glass or plastic-backed cells, thin-film-coated wafers (CIGS, CdTe, etc.) or traditional rigid silicon wafers prepared for tandem integration. Custom or standard vacuum chucks and magnetic or mechanical fixturing can be used to securely hold wafers in place during processing without contamination or damage.

Ease of use is another defining feature of the MSV100. With a simple setup process and plug-and-play modules, it’s easy to integrate into existing R&D workflows. The user-friendly control software allows for fast job configuration and minimizes the learning curve for new users. Its low-maintenance design, combined with long-life optical components, ensures that valuable lab time is spent on experimentation—not troubleshooting.

The MSV100 enables high-throughput experimentation without sacrificing accuracy or repeatability. Its architecture is scalable, allowing a smooth transition from small-part development to larger formats supported by msolv®’s production tools, such as the MSV200. For research labs, startups, and institutions seeking to commercialize new solar technologies, the MSV100 offers a cost-effective, high-performance solution. Whether used for P1, P2, or P3 scribing, the MSV100 provides a reliable platform that keeps pace with rapid iteration and innovation. From initial material discovery to device optimization, it stands out as a trusted tool for accelerating solar cell innovation. Its precision, modularity, and ease of use make it an essential asset for any PV research environment.

Part 5 coming up discusses the next steps in scaling PV, production-level laser processing with the MSV200. To learn more about how the MSV100 or any other equipment can support your development roadmap, contact msolv® to arrange a demo or technical consultation.