GROUNDBREAKING & NOVEL TECHNOLOGY
MSV300
The next generation of IC substrates and interposers are the keystone to the miniaturization of electronics. MSV300 is specifically designed for high resolution laser direct ablation (LDA) of organic substrates. It’s the system of choice for patterning substrates as part of the fanout process, ready for interposer or die attach.
Lower Cost Process – Beating Lithography And Direct Write
A technology gap has emerged in the IC substrate for feature dimensions 1 – 10 µm where conventional manufacturing methods are too expensive or low resolution. MSV300 competes in this space patterning both wiring and vias in a single, novel process. Smaller via-to-pad size ratios are obtainable due to super-registration. Not only that but the process speed is independent of feature density, owing to it being a mask-based process. This is another way it is cost-competitive.
Novel Technology Redefining IC Package Design
At the core of MSV300 is msolv’s proprietary technology Scanned Mask Imaging (SMI). SMI’s biggest advantage over standard processes is selective depth control – without multiple exposures or complex chemistry. You can achieve 3D structuring and densification by varying trace width & depth in unison. This mean integrated circuit designers can lower the number of ground planes: thicker, deep ground traces retain signal intensity and are more space-efficient. By rethinking this routing a designer can reduce process steps, reduce layer counts and IC package thickness.
MSV100 is designed for complex activities, this remarkable tool redefines precision. It boasts pinpoint accuracy, allowing you to sculpt intricate paths and profiles through materials with the assurance of meeting yield. Whether you’re delving into IC substrates, complex PCB, thin film PV, or transparent conducting oxides (yes, even ITO), this tool delivers. It’s a comprehensive solution for process development in microelectronics or photovoltaics.
Enabling Laser Embedded Conductor Technology
One key application for MSV300 is laser embedded conductors, these enable tracks to be formed within the surface of a IC substrate. It has superior copper adhesion due to “3-point anchoring” and standard low K, low CTE organic dielectrics may be used. Other benefits include reduced multi-layer device warpage due to better surface planarity. The result is more surface area and real estate for circuitry, densification and shorter paths.
Contact us to find out more about SMI technology and MSV300.
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Mr Peng
CHPT
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Nanobit