Choose from multiple IR lasers, UV nanosecond lasers, or fiber lasers to suit your specific requirements. Including two large optical breadboards for mounting lasers and optics, MSV500 has a wide range of possible configurations. It combines multiple process heads, compatibility with a wide range of lasers and large breadboards for mounting advanced or unique optics. MSV500 has ultra-high positional accuracy for immensely complex panels, up to ± 8 µm. This makes it an excellent partner for next generation applications on IC substrate. It can be equipped with a picosecond 532 nm green laser, specially-designed for drilling up to 15 µm diameter via, in a cold process. Using ultrafast DPSS lasers means no heat affected zone (HAZ), no damage to the substrate, and improved yield of your product. msolv®’s proprietary VERSA SPOT® technology reinforces the flexibility of MSV500. If you want application diversity in your system, to get better value for money, you need VERSA SPOT®. Our technology is unique, it allows you to rapidly switch between different sizes of via into skiving cavities for embedded components all in a single recipe! You don’t need to switch any hardware or change any optics — load the program and let the system do all of the hard work.